iPhone 7 Plus Teardown Shows 3GB of LPDDR4 RAM and a 2900mAh Battery



  • iFixit’s teardown for the iPhone 7 Plus is in
  • The iPhone 7 Plus sports Samsung-made RAM
  • The smartphone comes with Toshiba-made storage

Every year, the world holds its breath to learn the exact specifications of the latest iPhone models. After all, whileApple has started disclosing details like the number of cores in its latest mobile SoC, the company still doesn’t believe in disclosing details like the amount of RAM or the battery capacity on its smartphones. The first credible teardown of the iPhone 7 Plus is in, and we finally know these details.

Do-it-yourself repair site iFixit, best known for its comprehensive teardowns with the help of a few friends, got its hands on an iPhone 7 Plus out of Tokyo on Friday. It has been tearing down the smartphone and posting updates through the day, and now the cumbersome process is almost complete. Unfortunately, we’ll have to wait a little longer for iFixit’s iPhone 7 teardown.

Let’s get to the juicy details first, as iFixit hasn’t yet published its verdict about the repairability of the iPhone 7 Plus. The teardown reveals the iPhone 7 Plus sports 3GB of LPDDR4 RAM, and the unit torn down by iFixit sports a RAM module made by Samsung. Also onboard is the Qualcomm MDM9645M LTE. Cat 12 modem.


As for the battery, iFixit found the iPhone 7 Plus to come packing a 2900mAh battery, which is larger than the 2750mAh battery on the iPhone 6s Plus, but negligibly smaller than the 2915mAh offering on the iPhone 6 Plus. iFixit also notes that the 128GB NAND Flash chip included in their unit was made by Toshiba.

Another notable finding was just what Apple placed in the iPhone 7 Plus in the former location of the headphone jack. It turns out the Cupertino giant has placed a piece of moulded plastic that is speculated to either channel sound into the microphone, or out the new speaker grille just below it. The Taptic Engine controller which powers the pressure sensitive home button also takes up some of the space freed by the removal of the headphone jack.


Other major design changes noted include the presence of rubber gasket for the Lightning connector and the SIM tray, which also sports a plastic eject plug. These changes were of course made keeping in mind the IP67 rated dust and water resistance of the smartphone.